JPH0447739Y2 - - Google Patents

Info

Publication number
JPH0447739Y2
JPH0447739Y2 JP1986006698U JP669886U JPH0447739Y2 JP H0447739 Y2 JPH0447739 Y2 JP H0447739Y2 JP 1986006698 U JP1986006698 U JP 1986006698U JP 669886 U JP669886 U JP 669886U JP H0447739 Y2 JPH0447739 Y2 JP H0447739Y2
Authority
JP
Japan
Prior art keywords
drive
glass substrate
liquid crystal
crystal display
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986006698U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62118266U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986006698U priority Critical patent/JPH0447739Y2/ja
Publication of JPS62118266U publication Critical patent/JPS62118266U/ja
Application granted granted Critical
Publication of JPH0447739Y2 publication Critical patent/JPH0447739Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1986006698U 1986-01-21 1986-01-21 Expired JPH0447739Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986006698U JPH0447739Y2 (en]) 1986-01-21 1986-01-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986006698U JPH0447739Y2 (en]) 1986-01-21 1986-01-21

Publications (2)

Publication Number Publication Date
JPS62118266U JPS62118266U (en]) 1987-07-27
JPH0447739Y2 true JPH0447739Y2 (en]) 1992-11-11

Family

ID=30789455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986006698U Expired JPH0447739Y2 (en]) 1986-01-21 1986-01-21

Country Status (1)

Country Link
JP (1) JPH0447739Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574369B2 (ja) * 1988-03-07 1997-01-22 松下電器産業株式会社 半導体チップの実装体およびその実装方法
JP2826049B2 (ja) * 1992-11-18 1998-11-18 松下電子工業株式会社 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189626U (ja) * 1984-03-15 1984-12-15 セイコーエプソン株式会社 腕時計用液晶表示装置

Also Published As

Publication number Publication date
JPS62118266U (en]) 1987-07-27

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